Mitsubishi Materials (MMC) has begun development of a "thermal conductive putty" as a thermal conductive material to be sandwiched between high-temperature components, such as lithium-ion battery modules and electronic circuit boards, and low-temperature heat-dissipating components, such as heat sinks, to facilitate heat transfer from the former to the latter. Currently, the problem is that high-temperature components cannot be cooled sufficiently due to the interfacial thermal resistance that occurs at the contact surface between the high-temperature and low-temperature components. To overcome this problem, the company has created a technology that combines a filler having high thermal conductivity with a particular rubber to create a soft clay-like thermal conductive material. By applying this technology, the company will advance the development of a "thermal conductive putty" that molds to the shape of components it is in contact with to achieve closer adhesion.